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Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA
Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA

Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA

$ 4.22

Availability: 100 in stock

Description

Suction Wire Desoldering Tin Residue Strip Low Residue Welding Materials BGA Electronic Repair Welding Materials 10g 1.5M
Type: Suction Tin Wire
Solid Core
Material: Copper
Flux content: None (%)
Uses: Tin absorption
Material: Copper and special chemical refining
Tin absorption tape is a braided metal wire tape that can absorb molten solder by capillary action. It is used to absorb excess solder when removing tin. It is resistant to oxidation and corrosion. It has good thermal conductivity and good tin absorption.
During desoldering, after the chip is removed, there will be a lot of solder on the circuit board, which will affect the soldering of the chip. It is usually cleaned with a suction tape. The method is to place the soldering iron on the suction tape and slowly move it on the chip pad. When the solder melts, it will be picked up by the tin suction tape. The printing plate is very clean. After that, wash the position of the chip on the machine board with washing water.
Note: In order to prevent scalds, please do not directly touch the tin suction wire during use, please hold the case or use tools such as tweezers.